Semiconductor structure and method of forming the same

ABSTRACT

The present disclosure provides a semiconductor structure, including a logic region and a memory region adjacent to the logic region. The memory region includes a N th  metal layer, a bottom electrode over the N th  metal layer, a magnetic tunneling junction (MTJ) layer over the bottom electrode, a top electrode over the MTJ layer, and a (N+1) th  metal layer over the top electrode. The top electrode includes material having an oxidation rate lower than that of Tantalum or Tantalum derivatives. N is an integer greater than or equal to 1.

BACKGROUND

Semiconductors are used in integrated circuits for electronic applications, including radios, televisions, cell phones, and personal computing devices. One type of well-known semiconductor device is the semiconductor storage device, such as dynamic random access memories (DRAMs), or flash memories, both of which use charges to store information.

A more recent development in semiconductor memory devices involves spin electronics, which combines semiconductor technology and magnetic materials and devices. The spin polarization of electrons, rather than the charge of the electrons, is used to indicate the state of “1” or “0.” One such spin electronic device is a spin torque transfer (STT) magnetic tunneling junction (MTJ) device

MTJ device includes free layer, tunnel layer, and pinned layer. The magnetization direction of free layer can be reversed by applying a current through tunnel layer, which causes the injected polarized electrons within free layer to exert so-called spin torques on the magnetization of free layer. Pinned layer has a fixed magnetization direction. When current flows in the direction from free layer to pinned layer, electrons flow in a reverse direction, that is, from pinned layer to free layer. The electrons are polarized to the same magnetization direction of pinned layer after passing pinned layer; flowing through tunnel layer; and then into and accumulating in free layer. Eventually, the magnetization of free layer is parallel to that of pinned layer, and MTJ device will be at a low resistance state. The electron injection caused by current is referred to as a major injection.

When current flowing from pinned layer to free layer is applied, electrons flow in the direction from free layer to pinned layer. The electrons having the same polarization as the magnetization direction of pinned layer are able to flow through tunnel layer and into pinned layer. Conversely, electrons with polarization differing from the magnetization of pinned layer will be reflected (blocked) by pinned layer and will accumulate in free layer. Eventually, magnetization of free layer becomes anti-parallel to that of pinned layer, and MTJ device will be at a high resistance state. The respective electron injection caused by current is referred to as a minor injection.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a cross section of a semiconductor structure, in accordance with some embodiments of the present disclosure.

FIG. 2 is a cross section of a semiconductor structure, in accordance with some embodiments of the present disclosure.

FIG. 3 to FIG. 20 are cross sections of a CMOS-MEMS structure fabricated at various stages, in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in the respective testing measurements. Also, as used herein, the term “about” generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term “about” means within an acceptable standard error of the mean when considered by one of ordinary skill in the art. Other than in the operating/working examples, or unless otherwise expressly specified, all of the numerical ranges, amounts, values and percentages such as those for quantities of materials, durations of times, temperatures, operating conditions, ratios of amounts, and the likes thereof disclosed herein should be understood as modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the present disclosure and attached claims are approximations that can vary as desired. At the very least, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges can be expressed herein as from one endpoint to another endpoint or between two endpoints. All ranges disclosed herein are inclusive of the endpoints, unless specified otherwise.

Embedded MRAM cell in a CMOS structure has been continuously developed. A semiconductor circuit with embedded MRAM cell includes an MRAM cell region and a logic region separated from the MRAM cell region. For example, the MRAM cell region may locate at the center of the aforesaid semiconductor circuit while the logic region may locate at a periphery of the semiconductor circuit. Note the previous statement is not intended to be limiting. Other arrangement regarding the MRAM cell region and the logic region are enclosed in the contemplated scope of the present disclosure.

In the MRAM cell region, a transistor structure can be disposed under the MRAM structure. In some embodiments, the MRAM cell is embedded in the metallization layer prepared in a back-end-of-line (BEOL) operation. For example, the transistor structures in the MRAM cell region and in the logic region are disposed in a common semiconductor substrate, prepared in a front-end-of-line operation, and are substantially identical in the aforesaid two regions in some embodiments. The MRAM cell can be embedded in any position of the metallization layer, for example, between adjacent metal line layers distributed horizontally parallel to a surface of the semiconductor substrate. For instance, the embedded MRAM can be located between the 4^(th) metal line layer and the 5^(th) metal line layer in an MRAM cell region. Horizontally shifted to the logic region, the 4^(th) metal line layer is connected to the 5^(th) metal line layer though a 4^(th) metal via. In other words, taking the MRAM cell region and the logic region into consideration, the embedded MRAM occupies a thickness of at least a portion of the 5^(th) metal line layer and the 4^(th) metal via. The number provided for the metal line layer herein is not limiting. In general, people having ordinary skill in the art can understand that the MRAM is located between an N^(th) metal line layer and an (N+1)^(th) metal line layer, where N is an integer greater than or equal to 1.

The embedded MRAM includes a magnetic tunneling junction (MTJ) composed of ferromagnetic materials. A bottom electrode and a top electrode are electrically coupled to the MTJ for signal/bias conveyance. Following the example previously provided, the bottom electrode is further connected to the N^(th) metal line layer, whereas the top electrode is further connected to the (N+1)^(th) metal line layer. When a bias is applied across the (N+1)^(th) metal line layer, the top electrode, the MTJ, the bottom electrode, and the N^(th) metal line layer, one can obtain a series resistance R_(s) of the above combined structure when the corresponding current is measured. The series resistance R_(s) in an MRAM cell shall be reduced to as low as possible.

There is, however, a great series resistance R_(s) to be expected due to non-conductive layers between the aforesaid combined structures. For example, an oxide layer may be located between the top electrode and the (N+1)^(th) metal line layer. The formation of the oxide layer is due to a fast oxidation rate of the conventional material adopted for an MRAM electrode, such materials include, but are not limited to, tantalum (Ta), tantalum nitride (TaN), or the combinations thereof. Ta and/or TaN is widely adopted as materials for top electrode is due to the fact that the selectivity between such material (Ta, TaN) and hard mask and is high. A post-deposition bombardment operation may be adopted to remove the oxide layer and reduce the series resistance R_(s). However, due to the concurrent fabrication of the MRAM cell region and the logic region, the post-deposition bombardment operation may be effective for removing the oxide layer in the MRAM cell region, yet such bombardment can be detrimental to the uncovered metal line layers of the logic region. Therefore, post-deposition bombardment cannot be an effective solution to remove the oxide layer.

The present disclosure provides a top electrode of an MTJ that generate very little or no oxide layer, such that no post-deposition bombardment operation is required to remove the oxide layer in order to reduce the series resistance R_(s) of the MTJ.

Referring to FIG. 1, FIG. 1 is a cross section of a semiconductor structure 10, in accordance with some embodiments of the present disclosure. The semiconductor structure 10 can be a semiconductor circuit including a MRAM cell region 100A and a logic region 100B. Each of the MRAM cell region 100A and the logic region 100B has a transistor structure 101 in a semiconductor substrate 100. In some embodiments, the transistor structures 101 are substantially identical in the MRAM cell region 100A and in the logic region 100B. In some embodiments, the semiconductor substrate 100 may be but is not limited to, for example, a silicon substrate. In an embodiment, substrate 100 is a semiconductor substrate, such as a silicon substrate, although it may include other semiconductor materials, such as silicon germanium, silicon carbide, gallium arsenide, or the like. In the present embodiment, the semiconductor substrate 100 is a p-type semiconductor substrate (P-Substrate) or an n-type semiconductor substrate (N-Substrate) comprising silicon. Alternatively, the substrate 100 includes another elementary semiconductor, such as germanium; a compound semiconductor including silicon carbide, gallium arsenic, gallium phosphide, indium phosphide, indium arsenide, and/or indium antimonide; an alloy semiconductor including SiGe, GaAsP, AlInAs, AlGaAs, GalnAs, GaInP, and/or GaInAsP; or combinations thereof. In yet another alternative, the semiconductor substrate 100 is a semiconductor on insulator (SOI). In other alternatives, semiconductor substrate 100 may include a doped epi layer, a gradient semiconductor layer, and/or a semiconductor layer overlying another semiconductor layer of a different type, such as a silicon layer on a silicon germanium layer. The semiconductor substrate 100 may or may not include doped regions, such as a p-well, an n-well, or combination thereof.

The semiconductor substrate 100 further includes heavily doped regions such as sources 103 and drains 105 at least partially in the semiconductor substrate 100. A gate 107 is positioned over a top surface of the semiconductor substrate 100 and between the source 103 and the drain 107. Contact plugs 108 are formed in inter-layer dielectric (ILD) 109, and may be electrically coupled to the transistor structure 101. In some embodiments, the ILD 109 is formed on the semiconductor substrate 100. The ILD 109 may be formed by a variety of techniques for forming such layers, e.g., chemical vapor deposition (CVD), low-pressure CVD (LPCVD), plasma-enhanced CVD (PECVD), sputtering and physical vapor deposition (PVD), thermal growing, and the like. The ILD 109 above the semiconductor substrate 100 may be formed from a variety of dielectric materials and may, for example, be an oxide (e.g., Ge oxide), an oxynitride (e.g., GaP oxynitride), silicon dioxide (SiO₂), a nitrogen-bearing oxide (e.g., nitrogen-bearing SiO₂), a nitrogen-doped oxide (e.g., N₂-implanted SiO₂), silicon oxynitride (Si_(x)O_(y)N_(z)), and the like.

FIG. 1 shows a planar transistor having a doped region in the semiconductor substrate 100. However, the present disclosure is not limited thereto. Any non-planar transistor, such as a FinFET structure, can have raised doped regions.

In some embodiments, a shallow trench isolation (STI) 111 is provided to define and electrically isolate adjacent transistors. A number of STI 111 are formed in the semiconductor substrate 100. The STI 111, which may be formed of suitable dielectric materials, may be provided to isolate a transistor electrically from neighboring semiconductor devices such as other transistors. The STI 111 may, for example, include an oxide (e.g., Ge oxide), an oxynitride (e.g., GaP oxynitride), silicon dioxide (SiO₂), a nitrogen-bearing oxide (e.g., nitrogen-bearing SiO₂), a nitrogen-doped oxide (e.g., N₂-implanted SiO₂), silicon oxynitride (Si_(x)O_(y)N_(z)), and the like. The STI 111 may also be formed of any suitable “high dielectric constant” or “high K” material, where K is greater than or equal to about 8, such as titanium oxide (Ti_(x)O_(y), e.g., TiO₂), tantalum oxide (Ta_(x)O_(y), e.g., Ta₂O₅), barium strontium titanate (BST, BaTiO₃/SrTiO₃), and the like. Alternatively, the STI 111 may also be formed of any suitable “low dielectric constant” or “low K” dielectric material, where K is less than or equal to about 4.

Referring to FIG. 1, a metallization structure 101′ is disposed above the transistor structure 101. Because the N^(th) metal layer 121 may not be the first metal layer over the transistor structure 101, the omission of a portion of the metallization structure 101′ is represented by dots. In the MRAM cell region 100A, an MTJ structure 130 is disposed between an N^(th) metal line 121′ of the N^(th) metal layer 121 and an (N+1)^(th) metal line 123′ of the (N+1)^(th) metal layer 123, whereas in the logic region 100B, the N^(th) metal line 121′ is connected to the (N+1)^(th) metal line 123′ by an N^(th) metal via 122 of the N^(th) metal layer 121. In some embodiments, the metal lines and metal vias are filled with electrically conductive material, e.g. copper, gold or another suitable metal or alloy, to form a number of conductive vias. Metal lines and metal vias in different metal layers form an interconnect structure composed of substantially pure copper (for example, with a weight percentage of copper being greater than about 90 percent, or greater than about 95 percent) or copper alloys, and may be formed using the single and/or dual damascene processes. Metal lines and metal vias may be, or may not be, substantially free from aluminum. Interconnect structure includes a plurality of metal layers, namely M₁, M₂ . . . M_(N). Throughout the description, the term “metal layer” refers to the collection of the metal lines in the same layer. Metal layers M₁ through M_(N) are formed in inter-metal dielectrics (IMDs) 125, which may be formed of oxides such as un-doped Silicate Glass (USG), Fluorinated Silicate Glass (FSG), low-k dielectric materials, or the like. The low-k dielectric materials may have k values lower than 3.8, although the dielectric materials of IMDs 125 may also be close to 3.8. In some embodiments, the k values of the low-k dielectric materials are lower than about 3.0, and may be lower than about 2.5. The N^(th) metal via 122 may be formed by a variety of techniques, e.g., electroplating, electroless plating, high-density ionized metal plasma (IMP) deposition, high-density inductively coupled plasma (ICP) deposition, sputtering, physical vapor deposition (PVD), chemical vapor deposition (CVD), low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and the like.

Referring to the MRAM cell region 100A of the semiconductor structure 10, the MTJ structure 130 at least includes a bottom electrode 131, a top electrode 133, and an MTJ 135. In some embodiments, the bottom electrode 131 possesses a trapezoidal recess in a composite layer including SiC 141 and tetraethyl orthosilicate (TEOS) 142. Alternatively, the TEOS 142 can be replaced or combined with silicon-rich oxides (SRO). In some embodiments, the bottom electrode 131 may include nitrides such as TiN, TaN, Ta, or Ru. In some embodiments, the top electrode 133 includes materials with an oxidation rate lower than that of tantalum or tantalum derivatives such as TaN (hereinafter Ta/TaN). For example, TiN is adopted to be the materials for the top electrode 133 because the oxidation rate of TiN is lower than that of Ta or TaN. Although the selectivity between TiN and hardmask is not as high as the selectivity between Ta/TaN and hard mask, the benefit of low oxidation rate offsets the slightly low selectivity as far as TiN is concerned. Because each MTJ 130 is designed to have a predetermined pattern (usually in a circular shape), patterning of the top electrode 133 inevitably exposes a top surface of the top electrode to ambient. The oxidation rate of Ta/TaN is greater than that of TiN and thus an oxide layer is formed thicker in the conventional scheme where Ta/TaN is used as a top electrode, compared to the counterpart where TiN is used as a top electrode. In some embodiments, the bottom electrode 131 and the top electrode 133 may include same materials such as TiN.

The oxidation rate of TiN is slow enough to form very little or even no oxide layer over the top surface of the top electrode under a manufacturing operation of an embedded MRAM cell. Comparing the MRAM cell region 100A and the logic region 100B, a thickness of the MTJ structure 130 is substantially equal to a sum of the thickness T2 of the N^(th) metal via 122 and the thickness T1 of a portion of (N+1)^(th) metal line 123′.

In some embodiments as shown in the MRAM cell region 100A of FIG. 1, the (N+1)^(th) metal line 123′ is surrounded by SiC 141 in addition to the IMDs 125, while the (N+1)^(th) metal line 123′ and the N^(th) metal via 122 in the logic region 100B is surrounded by the IMDs 125 only. As shown in FIG. 1, a sidewall of the MTJ 135 is protected by a protection layer 127 such as a nitride layer. In some embodiments, the protection layer 127 includes silicon nitrides. In some embodiments, a dielectric layer 129 can be disposed over the protection layer 127. In some embodiments, a TEOS layer 143 can be disposed over the SiC 141, surrounding the (N+1)^(th) metal line 123′.

In some embodiments, the bottom electrode 131 of the MTJ structure 130 is electrically coupled with the doped region. In some embodiments, the doped region is a drain 105 or a source 103. In other embodiments, the bottom electrode 131 of the MTJ structure 130 is electrically coupled with the gate 107. In some embodiments, the gate 107 of the semiconductor structure 10 can be a polysilicon gate or a metal gate.

Referring to FIG. 2, FIG. 2 is a cross section of a semiconductor structure 20, in accordance with some embodiments of the present disclosure. Identical numeral labels in FIG. 2 are referred to identical elements or equivalents thereof as shown in FIG. 1 and are not repeated here for simplicity. A difference between the semiconductor structure 20 from the semiconductor structure 10 lies in that the top electrode 130 of the MTJ structure 130 includes more than material. For example, the top electrode 133 can include a lower portion 133A in contact with a top surface of the MTJ 135 and an upper portion 133B in contact with a bottom surface of the (N+1)^(th) metal line 123′. The upper portion 133B of the top electrode 133 is made of a material having a lower oxidation rate than that of the lower portion 133A of the top electrode 133. In some embodiments, the upper portion 133B includes TiN whereas the lower portion 133A includes Ta/TaN. In some embodiments, a thickness of the lower portion 133A is greater than a thickens of the upper portion 133B. However, the present disclosure is not intended to limit the thickness of each electrode stack as long as an interface between the top electrode 133 and the (N+1)^(th) metal line 123′ is made of TiN.

FIG. 3 to FIG. 20 are cross sections of a CMOS-MEMS structure fabricated at various stages, in accordance with some embodiments of the present disclosure. In FIG. 3, a semiconductor structure having a predetermined MRAM cell region 100A and a logic region 100B is provided. In some embodiments, a transistor structure is pre-formed in a semiconductor substrate (not shown in FIG. 3). The integrated circuit device may undergo further CMOS or MOS technology processing to form various features known in the art. For example, one or more contact plugs, such as silicide regions, may also be formed. The contact features may be coupled to the source and drain. The contact features comprise silicide materials, such as nickel silicide (NiSi), nickel-platinum silicide (NiPtSi), nickel-platinum-germanium silicide (NiPtGeSi), nickel-germanium silicide (NiGeSi), ytterbium silicide (YbSi), platinum silicide (PtSi), iridium silicide (IrSi), erbium silicide (ErSi), cobalt silicide (CoSi), other suitable conductive materials, and/or combinations thereof. In an example, the contact features are formed by a salicide (self-aligned silicide) process.

An N^(th) metal line 121′ is patterned in a dielectric layer 135 over the transistor structure. In some embodiments, the N^(th) metal line 121′ can be formed of an electroplating operation with a Cu seed layer deposited over the patterned dielectric layer 135. In other embodiments, the N^(th) metal line 121′ may be formed by a variety of techniques, e.g., electroless plating, high-density ionized metal plasma (IMP) deposition, high-density inductively coupled plasma (ICP) deposition, sputtering, physical vapor deposition (PVD), chemical vapor deposition (CVD), low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and the like. A planarization operation is performed to expose a top surface of the N^(th) metal line 121′ and the top surface of the dielectric layer 135.

In FIG. 4, a barrier layer 140 in a form of a stacking layer including a SiC layer 141 and a TEOS/SRO layer 142 are blanket deposited over a top surface of the N^(th) metal line 121′ and a top surface of the dielectric layer 135, in both the MRAM cell region 100A and the logic region 100B. The barrier layer 140 can be formed by a variety of techniques, e.g., chemical vapor deposition (CVD), low-pressure CVD (LPCVD), plasma-enhanced CVD (PECVD), sputtering and physical vapor deposition (PVD), thermal growing, and the like. In FIG. 5, a photoresist layer (not shown) is patterned over the stacking layer to expose a bottom electrode region of the MTJ structure. As shown in FIG. 5, a bottom electrode via hole 131′ is formed in the barrier layer 140 by a suitable dry etch operation. In some embodiments, the dry etch in the present operation includes reactive ion etch (RIE) adopting fluorine-containing gases. In some embodiments, the present dry etch operation can be any suitable dielectric etch to form via trenches in a metallization structure of conventional CMOS technology. Referring to the logic region 100B as shown in FIG. 5, the barrier layer 140 is protected by the photoresist layer (not shown) such that a top surface of the N^(th) metal layer 121′ is not exposed as opposed to the counterpart in the MRAM cell region 100A.

In FIG. 6, a diffusion barrier layer 161 is blanket lined over the bottom electrode via hole 131′ in the MRAM cell region 100A and over the barrier layer 140 in the logic region 100B. Subsequently, a first deposition of bottom electrode material 131A is conducted to be disposed over the diffusion barrier layer 161 and the barrier layer 140. The first deposited bottom electrode material 131A may be formed by a variety of techniques, e.g., high-density ionized metal plasma (IMP) deposition, high-density inductively coupled plasma (ICP) deposition, sputtering, physical vapor deposition (PVD), chemical vapor deposition (CVD), low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and the like. The diffusion barrier layer 161 and the first deposited bottom electrode material 131A is then etched back to level with a top surface of the barrier layer 140, as illustrated in FIG. 7. In some embodiments, etch back operation includes a chemical mechanical polishing (CMP). If the opening of the bottom electrode via hole 131′ is wider than a predetermined value, a dishing effect occurs in the first deposited bottom electrode material 131A as a result of CMP operation. In FIG. 8, a second deposition of bottom electrode material 131B is blanket formed over the first deposited bottom electrode material 131A and the barrier layer 140. The second deposited bottom electrode material 131B may be formed by a variety of techniques, e.g., high-density ionized metal plasma (IMP) deposition, high-density inductively coupled plasma (ICP) deposition, sputtering, physical vapor deposition (PVD), chemical vapor deposition (CVD), low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and the like. The second deposited bottom electrode material 131B is then thinned to a predetermined thickness T3, as illustrated in FIG. 9. In some embodiments, etch back operation includes a CMP. In some embodiments, the diffusion barrier layer 161 can be composed of nitride materials, for example, TiN. The first deposited bottom electrode material 131A and the second deposited bottom electrode material 131B can be composed of metal nitride such as TaN, TiN, or the combinations thereof or Ta.

FIG. 10A and FIG. 10B show two scenarios of the top electrode formation of an MTJ structure. In FIG. 10A, an MTJ 135 is deposited in a form of multiple material stacks over the bottom electrode 131B. In some embodiments, the MTJ 135 is having a thickness of from about 150 Å to about 250 Å. The MTJ 135 may be formed by variety of techniques, e.g., high-density ionized metal plasma (IMP) deposition, high-density inductively coupled plasma (ICP) deposition, sputtering, physical vapor deposition (PVD), chemical vapor deposition (CVD), low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and the like. In some embodiments, the MTJ 135 may include ferromagnetic layers, spacers, and a capping layer. The capping layer is formed on the ferromagnetic layer. Each of the ferromagnetic layers may include ferromagnetic material, which may be metal or metal alloy, for example, Fe, Co, Ni, CoFeB, FeB, CoFe, FePt, FePd, CoPt, CoPd, CoNi, TbFeCo, CrNi or the like. The spacer may include non-ferromagnetic metal, for example, Ag, Au, Cu, Ta, W, Mn, Pt, Pd, V, Cr, Nb, Mo, Tc, Ru or the like. Another spacer may also include insulator, for example, Al₂O₃, MgO, TaO, RuO or the like. The capping layer may include non-ferromagnetic material, which may be a metal or an insulator, for example, Ag, Au, Cu, Ta, W, Mn, Pt, Pd, V, Cr, Nb, Mo, Tc, Ru, Ir, Re, Os, Al₂O₃, MgO, TaO, RuO or the like. The capping layer may reduce write current of its associated MRAM cell. The ferromagnetic layer may function as a free layer whose magnetic polarity or magnetic orientation can be changed during write operation of its associated MRAM cell. The ferromagnetic layers and the spacer may function as a fixed or pinned layer whose magnetic orientation may not be changed during operation of its associated MRAM cell. It is contemplated that the MTJ 135 may include an antiferromagnetic layer in accordance with other embodiments. Following the formation of the MTJ 135, a top electrode layer 133 is deposited over the MTJ 135. The top electrode layer 133 may be formed by a variety of techniques, e.g., high-density ionized metal plasma (IMP) deposition, high-density inductively coupled plasma (ICP) deposition, sputtering, physical vapor deposition (PVD), chemical vapor deposition (CVD), low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and the like. In some embodiments, the top electrode layer 133 is composed of TiN.

In FIG. 10B, an MTJ 135 is deposited in a form of multiple material stacks over the bottom electrode 131B as discussed previously. Following the formation of the MTJ 135, a composite top electrode layer 133B and 133A are deposited over the MTJ 135. The composite top electrode layer 133B and 133A may be each formed by a variety of techniques, e.g., high-density ionized metal plasma (IMP) deposition, high-density inductively coupled plasma (ICP) deposition, sputtering, physical vapor deposition (PVD), chemical vapor deposition (CVD), low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and the like. In some embodiments, the composite top electrode layer 133B and 133A is composed of a material with a greater oxidation rate at a lower portion of the composite top electrode layer 133B and a material with a smaller oxidation rate at an upper portion of the composite top electrode layer 133A. In some embodiments, the lower portion of the composite top electrode layer can be composed of Ta/TaN, whereas the upper portion of the composite top electrode layer can be composed of TiN.

Referring to FIG. 11A and FIG. 11B, a mask layer (not shown) is formed over the top electrode 133 (see FIG. 11A) or the composite top electrode 133B and 133A (see FIG. 11B) (hereinafter “top electrode 133B/133A”) for the ensuing MTJ structure formation. The mask layer may have a multi-layer structure, which may include, for example, an oxide layer, an advanced patterning film (APF) layer and an oxide layer. Each of the oxide layer, the APF layer, and the oxide layer may be formed by a variety of techniques, e.g., high-density ionized metal plasma (IMP) deposition, high-density inductively coupled plasma (ICP) deposition, sputtering, physical vapor deposition (PVD), chemical vapor deposition (CVD), low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and the like. In some embodiments, the mask layer is configured to pattern the MTJ 135, the top electrode 133 B/133A, and the second deposited bottom electrode 131B. For example, a width of the masking region is determined according to the desired MTJ diameter. In some embodiments, the MTJ 135 and the top electrode 133B/133A are formed by an RIE to have a trapezoidal shape viewing from a cross section.

In FIG. 12, a protection layer 127 is conformally formed over the MTJ 135 and the top electrode 133. In some embodiments, the protection layer 127 possesses a thickness of from about 50 Å to about 300 Å. Note a sidewall of the MTJ 135 and the sidewall of the second deposited bottom electrode 131B are surrounded by the protection layer 127 to prevent oxidation or other contamination. Subsequently, a dielectric layer 129 such as a TEOS layer is conformally deposited over the protection layer 127. In some embodiments, a thickness of the dielectric layer 129 is to be determined according to a level of a top surface thereof relative to the top surface of the top electrode 133. For example, a top surface of the dielectric layer 129 at the logic region 100B is to be greater than or about equal to a top surface of the top electrode 133 of an MTJ structure 130. In FIG. 13, a planarization operation is performed on the dielectric layer 129 such that the top surface of the dielectric layer 129 is substantially flat across the MRAM cell region 100A and the logic region 100B. As shown in FIG. 13, the top surface of the top electrode 133 is exposed from the dielectric layer 129 after the planarization operation. Note the top surface of the top electrode 133 shall be composed of TiN no matter the top electrode is a single or a composite material layer.

In FIG. 14 to FIG. 16, an upper portion of the barrier layer 140, the protection layer 127, and the dielectric layer 129 are removed from the logic region 100B by an etch back operation, as illustrated in FIG. 14. Hence, the MRAM cell region 100A is in greater height than the logic region 100B. In FIG. 15, a dielectric layer-low k-dielectric layer composite 180 is formed to comformally cover the MRAM cell region 100A and the logic region 100B. A step difference 181 can be observed in FIG. 15, therefore, an etch back operation as illustrated in FIG. 16 is performed to obtain a substantially flat top surface for the following trench formation in both the MRAM cell region 100A and the logic region 100B. Note a dielectric layer 183 of the dielectric layer-low k-dielectric layer composite 180 is remained virtually in the logic region 100B after the aforesaid planarization operation. The dielectric layer 183 is deliberately kept to act as a protection layer for the subsequent trench formation. The dielectric layer 183 can prevent the acidic solution from damaging the low k dielectric layer during a photoresist stripping operation.

In FIG. 17, photoresist (not shown) is patterned over the planarized dielectric surface to form trenches for metal lines and metal via. For example, in the MRAM cell region 100A, a (N+1)^(th) metal line trench 123A is formed over the MTJ structure 130, exposing a top surface of the top electrode 133 of the MTJ structure 130. In the logic region 100B, an N^(th) metal via trench and an (N+1)^(th) metal line trench (combinatory 123B) is formed over the N^(th) metal line 121′, exposing a top surface of the N^(th) metal line 121′. If the top electrode 133 is composed of a material with high oxidation rate, such as TaN, a considerable thick oxide layer can be observed on the top surface of the top electrode 133 since said top surface is exposed after the formation of the metal line trench 123A. Conventionally, an oxide bombardment operation is used to remove the oxide layer. However, because the N^(th) metal via trench and an (N+1)^(th) metal line trench 123B are also exposed in the logic region 100B, the oxide bombardment operation may inevitably damage the sidewall and the bottom of the N^(th) metal via trench and an (N+1)^(th) metal line trench 123B. If the top electrode 133 is composed of a material with low oxidation rate, such as TiN, very little or even no oxide layer can be observed on the top surface of the top electrode 133. In this connection, no oxide bombardment operation is required to remove such oxide layer and the sidewall/bottom integrity of the N^(th) metal via trench and an (N+1)^(th) metal line trench 123B can be preserved.

In FIG. 18 and FIG. 19, conductive metal fills the metal line trench/metal via trench (hereinafter “trenches”) through, for example, a conventional Dual Damascene operation. The patterned trenches are filled with a conductive material by an electroplating operation, and excess portions of the conductive material are removed from the surface using a chemical mechanical polishing (CMP) operation, an etch operation, or combinations thereof. Details of electroplating the trenches are provided below. (N+1)^(th) metal line 123′ may be formed from W, and more preferably from copper (Cu), including AlCu (collectively, Cu). In one embodiment, (N+1)^(th) metal lines 123′ are formed using the Damascene operation, which should be familiar to those in the art. First, trenches are etched through the low k dielectric layer. This process can be performed by plasma etch operation, such as an Inductively Coupled Plasma (ICP) etch. A dielectric liner (not shown) then may be deposited on the trenches sidewalls. In embodiments, the liner materials may include silicon oxide (SiO_(x)) or silicon nitride (SiN_(x)), which may be formed by plasma deposition process, such as physical vapor deposition (PVD) or chemical vapor deposition (CVD) including plasma enhanced chemical vapor deposition (PECVD). Next, a seed layer of Cu is plated in the trenches. Note the seed aleyr of Cu may be plated over a top surface of the top electrode 133. Then a layer of copper is deposited in the trenches, followed by planarization of the copper layer, such as by chemical mechanical polishing (CMP), down to the top surface of a low k dielectric layer. The exposed copper surface and dielectric layer can be coplanar.

After the planarization operation removing the overburden of the conductive metal as illustrated in FIG. 19, an (N+1)^(th) metal line 123′ in both the MRAM cell region 100A and the logic region 100B, as well as an N^(th) metal via 122 in the logic region 100B, are formed. In FIG. 20, a subsequent barrier layer 141 and (N+1)^(th) metal via trench as well as (N+2)^(th) metal line trench are formed in the low k dielectric layer. Subsequent processing may further include forming various contacts/vias/lines and multilayer interconnect features (e.g., metal layers and interlayer dielectrics) over the substrate, configured to connect the various features or structures of the integrated circuit device. The additional features may provide electrical interconnection to the device including the formed metal gate structures. For example, a multilayer interconnection includes vertical interconnects, such as conventional vias or contacts, and horizontal interconnects, such as metal lines. The various interconnection features may implement various conductive materials including copper, tungsten, and/or silicide. In one example a damascene and/or dual damascene process is used to form a copper related multilayer interconnection structure.

Some embodiments of the present disclosure provide a semiconductor structure, including a logic region and a memory region adjacent to the logic region. The memory region includes a Nth metal layer, a bottom electrode over the Nth metal layer, a magnetic tunneling junction (MTJ) layer over the bottom electrode, a top electrode over the MTJ layer, and a (N+1)th metal layer over the top electrode. The top electrode includes material having an oxidation rate lower than that of Tantalum or Tantalum derivatives. N is an integer greater than or equal to 1.

Some embodiments of the present disclosure provide a semiconductor structure, including a logic periphery and a magnetic random access memory (MRAM) cell. The logic periphery includes a transistor region, and a Nth metal over the transistor region. The MRAM cell includes the (N+1)th metal and a top electrode in contact with the (N+1)th metal. The top electrode includes TiN at an interface between the top electrode and the (N+1)^(th) metal. N is an integer greater than or equal to 1.

Some embodiments of the present disclosure provide a method for manufacturing a semiconductor structure. The method includes (1) forming an Nth metal in a memory region and in a logic region, (2) forming a magnetic random access memory (MRAM) cell in the memory region, wherein a top electrode of the MRAM cell includes TiN, and (3) forming a (N+1)th metal above the Nth metal in the logic region and the memory region.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present invention, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present invention. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps. 

1. A semiconductor structure, comprising: a logic region; a memory region adjacent to the logic region, the memory region comprises: a N^(th) metal layer; a bottom electrode over the N^(th) metal layer; a magnetic tunneling junction (MTJ) layer over the bottom electrode; a top electrode over the MTJ layer; and a (N+1)^(th) metal layer over the top electrode; wherein the top electrode comprises: an upper portion, interfacing with a bottom surface of the (N+1)^(th) metal layer, the upper portion being composed of material having a first oxidation rate; and a lower portion, interfacing with a top surface of the MTJ layer, the lower portion being composed of material having a second oxidation rate, wherein the first oxidation rate is slower than the second oxidation rate, and wherein N is an integer greater than or equal to
 1. 2. The semiconductor structure of claim 1, wherein the upper portion of the top electrode comprises TiN.
 3. The semiconductor structure of claim 1, wherein the lower portion of the top electrode is composed of Tantalum or Tantalum derivatives.
 4. The semiconductor structure of claim 1, wherein the N^(th) metal layer in the logic region comprises N^(th) metal line and N^(th) metal via.
 5. The semiconductor structure of claim 1, wherein the N^(th) metal layer and the (N+1)^(th) metal layer comprises copper.
 6. The semiconductor structure of claim 1, wherein the bottom electrode and the top electrode comprises same material.
 7. The semiconductor structure of claim 1, wherein the memory region is an embedded MRAM.
 8. A semiconductor structure, comprising: a logic periphery, comprising: a transistor region; a N^(th) metal over the transistor region; and a (N+1)^(th) metal over the N^(th) metal; and a magnetic random access memory (MRAM) cell, comprising: the (N+1)^(th) metal; and a top electrode in contact with the (N+1)^(th) metal, wherein the top electrode comprises: TiN at an interface between the top electrode and the (N+1)^(th) metal; and a tantalum layer or a tantalum derivative layer under the TiN, wherein N is an integer greater than or equal to
 1. 9. The semiconductor structure of claim 8, wherein the MRAM cell further comprises a magnetic tunneling junction (MTJ) layer.
 10. The semiconductor structure of claim 8, wherein the MRAM cell further comprises a bottom electrode having a same material with the top electrode.
 11. The semiconductor structure of claim 9, wherein the tantalum layer or the tantalum derivative layer is in contact with the MTJ layer.
 12. The semiconductor structure of claim 8, wherein the N^(th) metal comprises an N^(th) metal line and an N^(th) metal via.
 13. The semiconductor structure of claim 12, wherein the (N+1)^(th) metal line and the N^(th) metal via are surrounded by low-k dielectric in the logic periphery.
 14. The semiconductor structure of claim 10, wherein the MTJ layer is surrounded by a nitride layer.
 15. The semiconductor structure of claim 10, wherein the (N+1)^(th) metal is partially surrounded by SiC in the MRAM cell.
 16. A method for manufacturing a semiconductor structure, the method comprising: forming an N^(th) metal in a memory region and in a logic region; forming a magnetic tunneling junction (MTJ) layer over the N^(th) metal; forming a top electrode over the MTJ layer in the memory region, comprising: forming a lower portion of the top electrode interfacing with a top surface of the MTJ layer, the lower portion being composed of material having a first oxidation rate; and forming an upper portion of the top electrode over the lower portion, the upper portion being composed of material having a second oxidation rate, wherein the first oxidation rate is slower than the second oxidation rate; and forming a (N+1)^(th) metal above the N^(th) metal in the logic region and the memory region.
 17. The method of claim 16, wherein the forming the (N+1)^(th) metal comprises forming an N^(th) metal via and an (N+1)^(th) metal line in the logic region.
 18. The method of claim 17, wherein the forming the (N+1)^(th) metal comprises a Dual Damascene operation.
 19. (canceled)
 20. The method of claim 16, wherein the forming the (N+1)^(th) metal above the N^(th) metal in the memory region comprises electroplating copper over a TiN surface.
 21. The method of claim 16, wherein the upper portion of the top electrode interfaces with a lower surface of the (N+1)^(th) metal in the memory region. 